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Item | Specifications | ||
Model | L15 | ||
Machine option | Automatic add solder paste function. Automatic stencil inspection function. Automatic dispensing system. Squeegee pressure feedback function. Automatic MSE/SPI online function. Automatic constant temperature and humidity function. | ||
Screen frames | Min Size | 370x370mm | |
Max Size | 737x737mm | ||
Thickness | 25~40mm | ||
PCB Min Size | 50x50mm | ||
PCE Max Size | 400x340mm | ||
PCB thickness | 0.4-6mm | ||
PCU warpage | <1% | ||
Transport height | 900±40mm | ||
Transport direction | Left-Right, Right-Left, Left-Left, Right-Right | ||
Transport Speed | Max 1500mm/S Programmable | ||
Board Location | Support System | Magnetic Pin/Up-down table adjusted/ support block by hand | |
PCR Positioning | Clamping System | side clamping, vaccum nozzle | |
Print head | Two independent motorized print heads | ||
Squeegee Speed | 6~200mm/sec | ||
Squeegee Pressure | 0-15Kg | ||
Squeegee Angle | 60°/55°/45° | ||
Squeegee Type | Stainless steel(Standard), plastic | ||
Stencil Separation Speed | 0.1-20mm/sec Programmable | ||
Cleaning System | Dry, Wet. Vacuum (Programmable) | ||
Table Adjustment ranges | X: ±10mm, Y: ±10mm, θ:±2° | ||
CCD FOV | 8*6 mm | ||
Solder Paste Inspection | 2D Inspection standard | ||
Solder paste printer Machine | |||
Repeat Position Accuracy | ±0.01 mm | ||
Printing Accuracy | ±0.025 mm | ||
Cycle Time | <7s (Exclude Printing& Cleaning) | ||
Product Changeover | <5Min | ||
Air Required | 4.5~6Kg/cm² | ||
Power Input | AC:220+10%, 50/60HZ 3KW | ||
Control Method | PC control | ||
Machine Dimensions | 1220(L)X1375(W)X1500(H)mm | ||
Machine Weight | Approx:1000Kg |